A 1-part, die-attach electrically conductive adhesive specially designed for microelectronic chip-bonding applications. Ideal for application by automatic dispenser or hand probe.
When you’re working with microelectronic chip bonding applications, you need a special kind of electrically conductive adhesive. LOCTITE® ABLESTIK 84-1LMI die-attach adhesive is low bleed, low outgassing, and offers all-round superior performance to traditional soldering.